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 Professional Digital LCD Humidity Controlled
   
 Wide Door Series LCD Humidity Controlled
   
 Large-Scale Professional Digital LCD Humidity Controlled
   
 Digital Display Series
   
 Champagne Digital Display Series
   
 I-Cabi analog Dry Cabinet
   
 All-Weather Dry-Box
   
 Special Series
Storage of SMD packages after their removal from the moisture barrier bags
Storage of PCB (equipped on both sides) during the mounting process
Storage of Printed Circuit Board during the examination process
1) IC packages

  		•  Ultra-low humidity storage and handling of unsealed CSP,BGA,QFP etc
  		• Ultra-low humidity storage of PLD during the programming process
    2) PCBs

  		•  Dehumidification and moisture-proofing of Organic Thin Layered Boards, Printed Wiring Boards
  		• Ultra-low humidity handling of Pattern Film during its production process
    3) Silicon Wafer

  		•  Anti-oxidation
  		• High quality control with dust-proofing
    4) Ceramics

  		•  Ceramic Board, Ceramics Condenser and other Ceramics-related materials (powder)
    5) Liquid Crystal Glass (LCG) Board

  		•  Dehydration under the ambient temperature after polishing
    (Maintaining balanced desiccating and prevention of discharging and adhesion of chemicals)
    6) Optical Fiber, CCD etc

  		•  Ultra-low humidity storage of micro-lens
  		• Long term dehumidification and moisture-proof storage of devices which are not suitable for high temperature baking
    7) Crystal Resonator

  		•  Ultra-low humidity storage of Crystals, Electrode Materials and Binding Materials
    8) Other Electric Components

  		•  Anti-oxidation of lead frame and bonding wire

     

    Perfect ultra-low RH storage in HuiTong Dry-Cabinet

    Once parts have been removed from their moisture barrier bags and placed safety in SUPER DRY defects at the end of the line will be reduced.

    The mechanism of micro-crack in Integrated Circuits (ICs) packages
      Before reflow Reflow process
    IC packages

    BGA
    CSP
    QFP
    TQFP
    etc    		 Normal Storage
    Moisture in the air is absorbed in the package.
       
    Delamination by heating at the first stage. As process goes on,more pressure by heating will make the delamination become bigger.   The pressure from delamination makes cracks in the packages.
    Cracks do not make any defects at first,however it gradually corrodes the IC chip.
    HuiTng DRY-Cabinet Storage
    HuiTng DRY-Cabinet can dehumidify micro-moisture absorbed in the package.  
    JEDEC/IPC suggests the storage of device should be under 10%RH.  
    HuiTng DRY-Cabinet ensures high quality control for production with it ultra low humidity control.
    HYPERr series are recommended for the storage of IC packages during its production process. For faster dehumidification for taping devices, MT series are recommended.

     

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    Tel：0760—86361500 86361501　　Fax：0760—86361502
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